Etching Utra-thin IC Lead Frame Pin for Semiconductor
- Min. Order:
- 200 Piece/Pieces
- Min. Order:
- 200 Piece/Pieces
- Transportation:
- Ocean, Air, Express
- Port:
- NINGBO, SHANGHAI
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Contact Now| Place of Origin: | CHINA |
|---|---|
| Payment Type: | T/T |
| Incoterm: | FOB,CIF,EXW |
| Certificate: | ISO9001:2015 / ISO14001:2015 |
| HS Code: | 8542900000 |
| Transportation: | Ocean,Air,Express |
| Port: | NINGBO,SHANGHAI |
Etching Utra-thin IC Lead Frame Pin for Semiconductor
IC lead frame is the basic material for semiconductor packaging, so it is widely used in emerging products such as artificial intelligence, Internet of Things, smart manufacturing and new energy vehicles. The material we use in IC Lead Frame is C192 or C194 Copper. The production of lead frames by metal etching process can achieve higher precision, for example, we can produce multi-pin (more than 100 pins) products of smooth IC lead frame, and can also produce ultra-thin products, such as etched 0.125mm thickness products. Moreover, we can guarantee that our etched copper IC lead frame have uniform arrangement, straight etching line and also the half etching product's surface is smooth and delicate.
Below are the specific parameters of this product, please check more IC lead frame in our website for more ideas.
Copper, Copper alloys, Iron-nickel alloys
Silver, Gold, Palladium, Tin, Nickel plate
MATERIAL
THICKNESS
0.125 - 0.25mm
MINIMUM DIAMETER
0.05 mm
MINIMUM DISTANCE
0.18 - 0.3 mm
ACCURACY
+- 0.02 - +- 0.04 mm
FINISHING
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